发明名称 SUBSTRATE SUPPORT DEVICE, ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate support device in which the rearrangement work can be carried out quickly.SOLUTION: A substrate support device includes a pin member that can be held in the nozzle of a mounting head, having a lower surface to be supported on the support surface of a base plate, and an upper surface capable of supporting the back surface of the board on which an electronic component is mounted, and can hold the electronic component, a magnet provided in the pin member and generating a magnetic force for fixing the base plate and pin member, and a movement mechanism provided in the pin member, and capable of moving the magnet between a first position and a second position separated from the first position while supporting the lower surface on the support surface, and being operated by the nozzle.SELECTED DRAWING: Figure 5
申请公布号 JP2016171126(A) 申请公布日期 2016.09.23
申请号 JP20150048501 申请日期 2015.03.11
申请人 JUKI CORP 发明人 KAGAYA HIROYUKI
分类号 H05K13/04 主分类号 H05K13/04
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