| 摘要 |
PURPOSE:To reduce the number of steps of forming a plurality of PHS structure semiconductor chips, checking characteristics, sorting and assembling the chips by including a pellet having a pair of chips. CONSTITUTION:After a photoresist pattern is formed by a viahole PR mask, a substrate 2 is etched to form viaholes 1, a photoresist pattern is then formed by Au plating PR mask, and Au plating 4 is formed as a thick metal layer. Since the substrate 2 is very thin, it is bonded to a quartz plate. Approaching pair chips are merely coupled by an extremely thin metal of several 1,000Angstrom . Then, the pellet and the plate are separated through etching and pellet separating steps to separate the pellets at random, and the separated pellets form chip pairs of 6 cells. When the pellets are assembled, an insulated gate field effect semiconductor device having a PHS structure is obtained. |
