Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate

摘要

A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.

主权项

1. A device comprising:
a first surface configured to support a plurality of semiconductor substrates; a second surface that opposes the first surface such that the plurality of semiconductor substrates is between the first surface and the second surface; a driving unit operable to move the first surface toward the second surface until the first surface reaches a predetermined position; and a pressing unit operable to deliver a pressing force to the first surface towards the second surface; an instruction setting section including at least one instruction to implement cooperative control of the pressing unit by
moving the first surface toward the second surface with the driving unit,detecting a change in position of the first surface with a position sensor while the driving unit moves the first surface toward the second surface, andadjusting a volume of a main room of the pressing unit in response to the detected change in position of the first surface until the position sensor detects that the first surface has reached the predetermined position.