| 摘要 |
<p>Flux residue drawn by capillary action into the small gap between a conductor pattern support e.g. a printed circuit board, and a leadless electronic component surface mounted on the support is hard to remove and may corrode the conductor pattern. Herein the component is fixed to the support by a pad of adhesive elastomer so as to give a larger and hence more easily cleanable gap between component and support and the component connector pads are coupled to the conductor pattern by way of solder pillars formed by pre-loading the component connector pads and the pattern with precisely defined amounts of solder and, e.g. during a vapour phase re-flow, causing the pre-loads to merge and form the solder pillars.</p> |
