Electrolytic gold plating solution

摘要

An electrolytic gold plating solution including a soluble gold salt, a conductivity salt, and, in addition, a mixture of a lead compound and a complexing agent having the stability constant with lead of not less than 15 or a complex obtained from the lead compound and the complexing agent and/or an amine compound having a pyrrolidine, piperazine, piperidine, or pyridine skeleton.