Flatpack burn-in socket

摘要

A burn-in test socket for use with flatpack semiconductor components is disclosed. The flatpack burn-in socket is especially adapted for use with robotic assembly techniques. The socket comprises an insulative housing with a plurality of terminals adapted to be in registry with leads on a flatpack semiconductor device located in a conventional flatpack carrier. The terminals are doubly reversely formed to laterally wipe the leads during insertion. Electrical continuity of the socket terminals and dynamic electrical testing of the semiconductor device can be probed from above the socket.