发明名称 Low melting glass composition
摘要 Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.
申请公布号 US4743302(A) 申请公布日期 1988.05.10
申请号 US19870005040 申请日期 1987.01.20
申请人 VLSI PACKAGING MATERIALS, INC. 发明人 DUMESNIL, MAURICE E.;FINKELSTEIN, LEO
分类号 C03C3/12;C03C3/21;C03C8/24;(IPC1-7):C03C3/12;C03C14/00 主分类号 C03C3/12
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