| 摘要 |
PURPOSE:To obtain the title compound having a narrow molecular weight distribution width and a low melt viscosity and useful as a curing gent for epoxy resin, by condensing a specified resol with a phenol in the presence of an acid catalyst, removing water from the reaction mixture and removing the monomer from it. CONSTITUTION:An o-substituted phenol (a) of the formula (wherein R<1> is a 1-10C alkyl) and 1.5-2.5mol., per mol of component (a), of formaldehyde (generating material) (b) are subjected to a methylolation reaction at 10-60 deg.C for several hour to one week in the presence of 0.8-1.2mol., per mol of component (a), of an alkali catalyst to obtain a resol (A) based on an o-substituted phenol dimethylol derivative of formula II and/or a dihydroxydiphenylmethane dimethylol derivative of formula III. Component A is reacted with 1.1-20mol., per mol of component (a), of at least bifunctional phenol at 50-100 deg.C for 3-6hr in the presence of an acid catalyst, and the water and the monomers are removed from the reaction mixture to obtain the title compound having a total content of trinuclear and tetranuclear components >=45wt.% and a polydispersity <=1.2.
|
