| 摘要 |
PURPOSE:To prevent the cracking of a silicon pellet due to a tempera ture cycle and the thermal fatigue of a solder layer, and to improve reliability by wrapping in an S-shaped curve section formed to at least one part of electrodes connected to both sides of the pellet with a solder material and the pellet. CONSTITUTION:An S-shaped curve section 21 is shaped to a section extremely near a silicon pellet 1 in a band-shaped electrode 2 bonded with the top face of the silicon pellet 1. The silicon pellet 1, solder layers 4, 5 and the S-shaped curve section 21 of the band-shaped electrode 2 are surrounded with a silicone rubber 6, and the end sections of the band-shaped electrodes 2, 3 are left naturally in the surrounding section and coated with the molding material 7 of an epoxy resin. The molding material 7 has approximately a rectangular parallelopiped shape, the band-shaped electrodes 2, 3 are bent along the outside surface of the molding material 7 from a pair of opposite faces of a rectangular parallelopiped, and the end sections of both electrodes are positioned on the base of the molding material 7. Accordingly, force applied to the silicon pellet 1 due to a temperature change is relaxed by the expansion and contraction of the S-shaped curve section 21 of the band-shaped electrode 2. |
