| 摘要 |
PURPOSE:To obtain the soldering iron simultaneously performing the soldering of numerous places on the same plane by fixing the bar like chip coating in order an iron plating and titanium nitride film on the material having good thermal conductivity by press-fitting it into the hole of a substrate in plural pieces and aligning it in the same level by removing the titanium nitride film at non-pressure fitting side. CONSTITUTION:An iron layer 3 is formed by an electric plating for the peripheral face (U shape) of the metal base body 2 composed of a copper as a base body and a titanium nitride film 4 is formed with vapor deposition on the peripheral face thereof further to form a soldering iron 1. The upper end side of this soldering iron 1 is then fixed by respectively press-fitting into the plural holes formed on the substrate executing heating to remove the titanium nitride on the end face at the non-press fitting side of each soldering iron 1. The iron layer 3 exposed of each soldering iron 1 is subjected to grinding to align each end face on the same plane. The soldering at numerous places on the same plane can simultaneously be executed by using the soldering iron composed like this.
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