发明名称 PRODUCTION OF SUBSTRATE COATED WITH DIAMOND FILM
摘要 PURPOSE:To improve the adhesivity of a thin diamond film to a substrate, by depositing diamond particles on a metallic or composite metal substrate by electrodeposition and subjecting the substrate to plasma treatment in a mixed gas composed of a hydrocarbon gas and hydrogen gas. CONSTITUTION:A copper plate 12 having prescribed size and thickness is plated with an Ni plate 13 having a prescribed thickness to obtain an electrodeposition substrate 6 on which diamond particles 14 having prescribed diameter are deposited by electrodeposition. The substrate 6 is placed on a table 7 made of Al2O3 and positioned in a reactor 5, the pressure in the reactor 5 is adjusted to a prescribed level by operating a vacuum valve 4 and a gaseous mixture composed of H2 and CH4 at a specific ratio is introduced at a specific flow rate from a feeding apparatus 11 into the reactor 5 through a pipe 17. A microwave is introduced into the reactor 5 through a wave guide 2 to generate a plasma and the substrate is left standing for a prescribed period to effect vapor- phase plating.
申请公布号 JPS63285193(A) 申请公布日期 1988.11.22
申请号 JP19870121877 申请日期 1987.05.19
申请人 HITACHI CABLE LTD 发明人 YONEMOTO TAKAHARU;ONUKI MITSUAKI;MIYAKE YASUHIKO
分类号 C30B25/18;C30B29/04;H01L21/205;H01L23/14;H01L23/15 主分类号 C30B25/18
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