发明名称 |
PRODUCTION OF SUBSTRATE COATED WITH DIAMOND FILM |
摘要 |
PURPOSE:To improve the adhesivity of a thin diamond film to a substrate, by depositing diamond particles on a metallic or composite metal substrate by electrodeposition and subjecting the substrate to plasma treatment in a mixed gas composed of a hydrocarbon gas and hydrogen gas. CONSTITUTION:A copper plate 12 having prescribed size and thickness is plated with an Ni plate 13 having a prescribed thickness to obtain an electrodeposition substrate 6 on which diamond particles 14 having prescribed diameter are deposited by electrodeposition. The substrate 6 is placed on a table 7 made of Al2O3 and positioned in a reactor 5, the pressure in the reactor 5 is adjusted to a prescribed level by operating a vacuum valve 4 and a gaseous mixture composed of H2 and CH4 at a specific ratio is introduced at a specific flow rate from a feeding apparatus 11 into the reactor 5 through a pipe 17. A microwave is introduced into the reactor 5 through a wave guide 2 to generate a plasma and the substrate is left standing for a prescribed period to effect vapor- phase plating.
|
申请公布号 |
JPS63285193(A) |
申请公布日期 |
1988.11.22 |
申请号 |
JP19870121877 |
申请日期 |
1987.05.19 |
申请人 |
HITACHI CABLE LTD |
发明人 |
YONEMOTO TAKAHARU;ONUKI MITSUAKI;MIYAKE YASUHIKO |
分类号 |
C30B25/18;C30B29/04;H01L21/205;H01L23/14;H01L23/15 |
主分类号 |
C30B25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|