| 摘要 |
PURPOSE:To improve solder impregnancy by forming of a head engaged with the through hole of a semiconductor mounting substrate and a collar disposed under the head, and forming the lower side of the collar in a conical shape. CONSTITUTION:Two positions isolated at a predetermined interval of metal leads are held by two chucks one of which has a protrusion extended radially, and moved coaxially to form a collar 12 and recesses 21, 22 on the surface of the collar 12. Simultaneously, a retainer for holding the parts of the leads and having a conical recess is moved coaxially to form a conical section 14 on the opposite surface. Then, the leads of the section inserted into the through hole 32 of a semiconductor mounting substrate 31 are cut in an inserting length to form a head 11. Then, a protrusion 11a is so formed as to increase the diameter of the large-diameter section of the head 11 of a conductor pin 10 larger than the inner diameter of the hole 32. The leads opposite side to the head 11 with respect to the collar 12 are cut, and barrel-polished to be surface- finished. Thus, a uniform solder coating film is formed on the surface of the pin to enhance the reliability of solder wettability of the pin.
|
