| 摘要 |
An optical communication device includes a planar optical waveguide, a substrate, a light emitting element, a light receiving element, a first optical waveguide, and a second optical waveguide. The substrate is supported over the planar optical waveguide. The light emitting element and the light receiving element are electrically connected to the substrate. The planar optical waveguide defines a first guide hole and a second guide hole. The substrate defines a first receiving hole and a second receiving hole. The first optical waveguide includes a first sloped surface and is received in the first guide hole and the first receiving hole, such that the first sloped surface aligns with the light emitting element. The second optical waveguide includes a second sloped surface and is received in the second guide hole and the second receiving hole, such that the second sloped surface aligns with the light emitting element. |
| 主权项 |
1. An optical communication device, comprising:
a planar optical waveguide, the planar optical waveguide defining a first guide hole and a second guide hole; a substrate supported on the planar optical waveguide, and defining a first receiving hole and a second receiving hole, the first receiving hole spatially corresponding the first guide hole, and the second receiving hole spatially corresponding the second guide hole; a light emitting element supported on and electrically connected to the substrate, the light emitting element comprising a light emitting surface; a light receiving element supported on and electrically connected to the substrate, the light receiving element comprising a light receiving surface; a first guiding assembly comprising a first optical waveguide, the first optical waveguide comprising a first sloped surface, the first optical waveguide received in the first guide hole and the first receiving hole, with the first sloped surface aligning with the light emitting surface; a second guiding assembly comprising a second optical waveguide, the second optical waveguide comprising a second sloped surface, the second optical waveguide received in the second guide hole and the second receiving hole, with the second sloped surface aligning with the light receiving surface; a first controller; a processor; a second controller; and a storing element; wherein the planar optical waveguide comprises a top surface and a light guide portion formed on the planar optical waveguide, the substrate supported on the top surface, both the first guide hole and the second guide hole pass though the top surface and the light guide portion; wherein the substrate comprises a mounting surface and a bottom surface facing away from the mounting surface, the bottom surface is supported over the top surface, both the first controller and the processor are supported on the mounting surface, the first controller is electrically connected to the processor and the light emitting element; wherein both the second controller and the storing element are supported on the mounting surface, the second controller is electrically connected to the storing element and the light receiving element; and wherein the planar optical waveguide comprises a first connection pad, a second connection pad, a third connection pad, and a fourth connection pad, the mounting surface defines a first through hole, the first receiving hole, a second through hole, the second receiving hole, a third through hole, and a fourth through hole, all of the first receiving hole, the first through hole, the second through hole, the second receiving hole, the third through hole, and the fourth through hole run through the mounting surface and the bottom surface, each of the first through hole, the second through hole, the third through hole, and the fourth through hole is filled with a conductive element, the substrate comprises a fifth connection pad, a sixth connection pad, a seventh connection pad, and an eighth connection pad, a ninth connection pad, a tenth connection pad, an eleventh connection pad, and a twelfth connection pad, one end of the conductive element received in the first through hole is electrically connected to the first connection pad, the other end of the conductive element received in the first through hole is electrically connected to the fifth connection pad, one end of the conductive element received in the second through hole is electrically connected to the second connection pad, the other end of the conductive element received in the second through hole is electrically connected to the seventh connection pad, one end of the conductive element received in the third through hole is electrically connected to the third connection pad, the other end of the conductive element received in the third through hole is electrically connected to the ninth connection pad, one end of the conductive element received in the fourth through hole is electrically connected to the fourth connection pad, the other end of the conductive element received in the fourth through hole is electrically connected to the eleventh connection pad. |
