| 摘要 |
A pick and place head for transferring die or chips containing electronic circuitry from waffle packs to substrates prior to lead bonding operations. The pick and place head includes a spindle rotatably mounted at the end of an arm and carrying jaws which are extendable to grasp, retract and rotate a collet having a vacuum pickup tip. Embodied as part of the spindle is a vacuum sensor manifold which sealably receives the collet and cooperates with it to form part of a vacuum sensing system to detect pickup of the chip or die.
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