Process for metal-plating ceramic surfaces

摘要

The present invention relates to a process for wet metal-plating of ceramic substrates. More particularly this invention relates to the wet chemical copper plating of Al2O3 ceramics. It is essentially composed of a combined chemical pretreatment of the ceramic surface for chemical metallization without external electric current in such a manner that within only a single pretreatment step the substrate surface is chemically activated and is simultaneously covered with an adhesion promoter, and/or a sensitizer and/or an activator (catalyst).