发明名称 Pressure transfer plate assembly for a heat bonding apparatus
摘要 An improved pressure transfer plate assembly is provided for an apparatus to heat bond flexible printed circuits in a hydraulic press. The plate assembly comprises aluminum top and bottom plates with two or more thin sheet liners in between. A plurality of workpiece-locating pins are based in stainless steel plug inserts in the bottom plate to give excellent wear resistance. The alignment of top and bottom plates is effected by a plurality of plate-alignment pins screwed into the bottom plate and having slotted head portions to allow for easy removal and installation.
申请公布号 US4875966(A) 申请公布日期 1989.10.24
申请号 US19880242580 申请日期 1988.09.12
申请人 GENERAL DYNAMICS CORP., POMONA DIV. 发明人 PERKO, LOUIS S.
分类号 B30B15/06 主分类号 B30B15/06
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