发明名称 |
Pressure transfer plate assembly for a heat bonding apparatus |
摘要 |
An improved pressure transfer plate assembly is provided for an apparatus to heat bond flexible printed circuits in a hydraulic press. The plate assembly comprises aluminum top and bottom plates with two or more thin sheet liners in between. A plurality of workpiece-locating pins are based in stainless steel plug inserts in the bottom plate to give excellent wear resistance. The alignment of top and bottom plates is effected by a plurality of plate-alignment pins screwed into the bottom plate and having slotted head portions to allow for easy removal and installation.
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申请公布号 |
US4875966(A) |
申请公布日期 |
1989.10.24 |
申请号 |
US19880242580 |
申请日期 |
1988.09.12 |
申请人 |
GENERAL DYNAMICS CORP., POMONA DIV. |
发明人 |
PERKO, LOUIS S. |
分类号 |
B30B15/06 |
主分类号 |
B30B15/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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