REFLOW SOLDERING METHOD AND ITS DEVICE,申请号JP19880135566-传众专利搜索

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发明名称	REFLOW SOLDERING METHOD AND ITS DEVICE
摘要
申请公布号	JPH01305594(A)	申请公布日期	1989.12.08
申请号	JP19880135566	申请日期	1988.06.03
申请人	KONDO KENJI	发明人	KONDO KENJI
分类号	H05K3/34;B23K1/008	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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