发明名称 |
Metal-core printed wiring board and a process for manufacture thereof |
摘要 |
Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.
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申请公布号 |
US4894271(A) |
申请公布日期 |
1990.01.16 |
申请号 |
US19880190986 |
申请日期 |
1988.05.06 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HANI, KIYOSHI;HAYAMA, MUTSUKO;NISHIMOTO, YOSHIO;HISHIKI, HIROSHI;KIMURA, MINORU;NAKAI, TATSUSHI |
分类号 |
B32B15/14;H05K1/03;H05K1/05;H05K3/42;H05K3/44 |
主分类号 |
B32B15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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