发明名称 POWER MODULE PACKAGE
摘要 Disclosed is a power module package comprising: a housing equipped with a division bar to divide a first opening unit and a second unit and molded by injection molding; a power unit installed on one side of the housing; and a control unit assembled on the other side of the frame to be arranged on the first opening unit. The size of the first opening unit having the control unit arranged thereon is greater than the size of the second opening unit.
申请公布号 KR20160111826(A) 申请公布日期 2016.09.27
申请号 KR20150092906 申请日期 2015.06.30
申请人 SOLUM CO., LTD. 发明人 WOO, DONG SOON;YUN, SUN WOO
分类号 H01L23/04;H01L23/40;H01L23/48 主分类号 H01L23/04
代理机构 代理人
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