| 摘要 |
The device for cleaving semiconductor chips from a half-cut wafer (10) comprises a frame (3) having a vertically adjustable roller (1), a pneumatic cylinder (6) for driving the frame, and a tensioned steel band (7) on which a half-cut wafer (10) is loaded. The roller can be adjusted in its height, before the roller rolls on the half-cut wafer surface, by the rotation of two lead screws mounted on both ends of the roller so as to give or release the compression force onto or from the wafer surface. The half-cut wafer on the steel band may be broken into chips when the steel band is released from the compression force.
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