| 摘要 |
<p>Circuit boards that permit wave soldering of both leaded and surface mounted components to a common side. The circuit board carries plated grooves to provide interconnections between the components to be mounted to the board. For leaded components on the circuit board, holes are provided extending completely through the board, and the leaded components are mounted and soldered in a conventional fashion. For surface mounted (or leadless) components, small recesses or grooves are provided to accept the terminals of the components themselves. The grooves are plated with an electrically conductive material, and contain a hole that passes from the upper surface to the bottom surface of the circuit board. When the circuit board is wave soldered, in a conventional manner, solder from the wave soldering process engages the holes, passes through the holes to the upper surface of the circuit board, and then runs along the grooves in the upper surface of the circuit board. Upon solidifying, the solder provides an electrical connection between the components.</p> |
