| 摘要 |
Internal cells with specified spacing are arranged in rows within an internal cell area where the main logic circuitry is formed. Wiring lines for interconnections are distributed in the spaces between neighbouring cellular arrays. A surrounding bonding pad area for external circuit connections contains a reference voltage supply pad and lies inside an external cell area allotted to cells contg. input- output circuit. An innervoltage reference linearranged inside the bonding pad area connects the reference pad to internal cells while an outer reference voltage line connects it to external cells. |
