发明名称 PACKAGE FOR INTEGRATE CIRCUIT MODULE
摘要 The lead-forming protective member (30) is secured to the package over the external leads. It cooperates with recesses (20), formed in the corners of the module, to retain the leads in a required disposition relative to each other. Projections (40) from a surface (48) facing the module of the protective member, maintain the leads spaced from each other. The external leads are wrapped closely around an end (42) of the protective member to engage, and conform with, that end to enhance resistance of the leads to unwanted deformation.
申请公布号 KR900003827(B1) 申请公布日期 1990.06.02
申请号 KR19870001841 申请日期 1987.03.02
申请人 GENERAL MOTORS CORP 发明人 CHUNG JAMES E;CUEOS MARK A;RUTZ PHILIP A
分类号 H01L23/32;H01L23/057;H01L23/495;H01L23/50;H05K3/34;(IPC1-7):H01L23/32 主分类号 H01L23/32
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