Automatic visual measurement of surface mount device placement

摘要

A method for inspecting the placement and alignment of surface mounted components on printed circuit boards during assembly. After the component is placed on the board, an infrared camera provides an image of leads on the component and corresponding soldering pads, to which the leads are to be soldered, on the board in a single exposure. The image is then processed by a computer and the position and orientations of the leads of the component with respect to the soldering pads are determined. As a result, any unsatisfactory misalignment of the component can be detected and defective printed circuit boards identified.