首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
HIGH-FREQUENCY BONDING DEVICE
摘要
申请公布号
JPH02231105(A)
申请公布日期
1990.09.13
申请号
JP19890051394
申请日期
1989.03.03
申请人
SHINKO KOGYO CO LTD
发明人
WAKABAYASHI TAKENORI
分类号
B27M1/08;B29C65/52;B29C65/78
主分类号
B27M1/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method and system for three dimensional interaction of a subject
Character input method and handheld electronic device
Scanning mirror touch screen with minimum bezel height
Optical position sensing system and optical position sensor assembly with convex imaging window
Method and apparatus for wearable remote interface device
Display and thin-film-transistor discharge method therefor
Method for use of a food preparation device
Use of Fructus schisandrae and extracts thereof in preventing and decreasing toxic and side effects of antineoplastic drugs
Contact lenses for extended release of bioactive agents containing diffusion attenuators
Agrochemical formulations comprising a pesticide, an organic UV-photoprotective filter and coated metal-oxide nanoparticles
Anti-rhesus D monoclonal antibody
System for recovery of cadmium telluride (CdTe) from system components used in the manufacture of photovoltaic (PV) modules
Hydroxyphenyl phosphine oxide mixtures and their use as flame retardant's for epoxy resins
Liquid crystal composition and liquid crystal display device
Regeneration of alkali metal reagent
Purification of hydroformylated and hydrogenated fatty alkyl ester compositions
Water-soluble near-infrared absorbing coloring matters and aqueous inks containing same
Method of concentrating ozone gas and apparatus therefor
Aerosol separator
Apparatus and methods for compacting an intraocular lens
