VERTICAL STACK SYSTEM IN PACKAGE COMPRISING A FIRST LEVEL DIE, BACK-TO-BACK STACKED SECOND LEVEL DIES AND A THIRD LEVEL DIE WITH CORRESPONDING FIRST, SECOND AND THIRD REDISTRIBUTION LAYERS AND METHOD OF MANUFACTURING THEREOF

摘要

Vertically stacked system in package structures are described. A package includes a first level (125) molding (122) and fan out structure (130), a third level (185) molding (182) and fan out structure (190) and a second level (155) molding (152) and fan out structure (160) between the first and third levels (125, 185). The first level (125) molding (122) and fan out structure (130) includes a first level die (110), the second level (155) molding (152) and fan out structure (160) includes back-to-back facing dies (142), with a front surface of each die (142) bonded to a redistribution layer (130, 160), and the third level (185) molding (182) includes a third level die (172). A plurality of first level molding dies (110) may be used. The first level die (110) may be a volatile memory die, the second level dies (142) may be non-volatile memory dies and the third level die (172) may be an active die. In a method of forming the vertical stack system in package, a carrier substrate may be used and later removed.