| 发明名称 |
METHOD AND MEANS FOR BONDING OF LEAD WIRES FOR AN INTEGRATED CIRCUIT DEVICE |
| 摘要 |
<p>Bonding of lead wires (14) between electrical contact points (15) of an integrated circuit and the conductive elements of a flexible tape-like structure (10) on which the integrated circuit (13) is seated is accomplished by means of a vacuum chuck (18) having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.</p> |
| 申请公布号 |
EP0289102(A3) |
申请公布日期 |
1990.09.26 |
| 申请号 |
EP19880200840 |
申请日期 |
1988.04.28 |
| 申请人 |
LSI LOGIC CORPORATION |
发明人 |
LONG, JON |
| 分类号 |
H01L21/60;H01L21/00;H01L21/607;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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