| 摘要 |
Apparatus for soldering lead pins on IC packages mounted on a PCB with lead lines on the board comprises a mounting base with one or more pairs of arms, and heat source lamps focussing radiant heat onto the pin-line contact areas to melt solder applied to the lines, with each lamp connected to a respective arm and a support shaft having a lower end presser for steadying the package. The lamps are pivotably connected to the arms to permit adjustment of their angle of inclination. The lamps are pref. linear near-ir units and the shaft slides through the base and is adjustable vertically with respect to a work table. There may be two pairs of arms in rectangular crossing relation, each pair at a diff. level and each arm carrying a lamp.
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