SEPARATING DEVICE FOR MOLDED AND CHIPPED PARTS AND MOUNTING METHOD FOR MOLD THEREFOR,申请号JP19890147182-传众专利搜索

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发明名称	SEPARATING DEVICE FOR MOLDED AND CHIPPED PARTS AND MOUNTING METHOD FOR MOLD THEREFOR
摘要
申请公布号	JPH0319795(A)	申请公布日期	1991.01.28
申请号	JP19890147182	申请日期	1989.06.10
申请人	MORIMOTO HIDEO	发明人	MORIMOTO HIDEO
分类号	B26D7/18	主分类号	B26D7/18
代理机构		代理人
主权项
地址

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