| 摘要 |
An automated method for continuously patterning a tape with a plurality of different interconnection patterns, to which an integrated circuit may be bonded using tape automated bonding, including selectively exposing a portion of a photographic film layer of the tape to computer-directed energy forming an integrated circuit interconnection pattern, and an identifying pattern, and developing the film to provide an image of the interconnection pattern. A photoprocessable layer of the tape is then exposed through the film layer to directed energy and processed in conjunction with a conductive layer in order to provide conductors which correspond to the interconnection pattern being fabricated. Also disclosed is a method of high speed patterning of a tape to provide a plurality of duplicate interconnection patterns to which integrated circuit die may be bonded using tape automated bonding including continuously advancing the tape, intermittently illuminating an interconnection portion of a film layer of the tape with the integrated circuit interconnection pattern, processing the film and a photoresist layer of the portion to provide conductors in the interconnection pattern, and repeating the illuminating and processing to provide the plurality of duplicate interconnection patterns. Further disclosed is a novel material and apparatus for generating TAB tape including a dielectric substrate which defines sprocket holes, a layer of conductive material superimposed over the substrate, a layer of photoresist material superimposed over the layer of conductive material, and a layer of photographic film superimposed over the layer of photoresist.
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