发明名称 パワーモジュール用基板及びその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a power module which prevents swell and wrinkles from occurring on a surface of a circuit layer and achieves excellent power cycle resistance.SOLUTION: In a substrate 3 for a power module, a circuit layer 6 made of aluminum or an aluminum alloy is laminated on a ceramic substrate 2, and a nickel plating layer 9 is formed on a surface of the circuit layer 6. Hard particles 10 are provided in the nickel plating layer 9 dispersing therein and are buried so as to avoid exposing on the outermost surface of the nickel plating layer 9.
申请公布号 JP6031784(B2) 申请公布日期 2016.11.24
申请号 JP20120055160 申请日期 2012.03.12
申请人 三菱マテリアル株式会社 发明人 石塚 博弥
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
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