发明名称 |
Photosensitive resin composition and method of forming conductive pattern. |
摘要 |
<p>A photosensitive resin composition formed by dissolving a photosensitive resin and a metallic salt or a metal complex in a common solvent or by dispersing reduced metal colloid particles in a photosensitive resin. Also disclosed is a method of forming electrically conductive patterns by applying the photosensitive resin composition to a substrate, pre-baking the resin and then successively subjecting it to exposure, development and post-baking. The result is subjected to electroless plating, directly in the case of the photosensitive resin containing dispersed metal colloid particles, and after reducing the metallic salt or a metal complex to a metal in the case of the photosensitive resin composition containing a metallic salt or metal complex. The reduction of the metallic salt or metal complex is conducted after pre-baking or one of the ensuing steps.</p> |
申请公布号 |
EP0453235(A2) |
申请公布日期 |
1991.10.23 |
申请号 |
EP19910303374 |
申请日期 |
1991.04.16 |
申请人 |
NISSHINBO INDUSTRIES, INC. |
发明人 |
SUZUKI, TOSHIO, C/O TOKYO RESEARCH CENTER;MARUTSUKA, TOSHINORI, C/O TOKYO RESEARCH CENTER |
分类号 |
G03F7/00;G03F7/004;H05K3/18 |
主分类号 |
G03F7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|