IC LEAD SOLDER COATING DEVICE,申请号JP19900088791-传众专利搜索

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发明名称	IC LEAD SOLDER COATING DEVICE
摘要
申请公布号	JPH03291162(A)	申请公布日期	1991.12.20
申请号	JP19900088791	申请日期	1990.04.03
申请人	HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD	发明人	NAGATOMO KEIJI;ISHII YOSHIAKI
分类号	B23K1/20;B23K1/08;H01L23/50	主分类号	B23K1/20
代理机构		代理人
主权项
地址

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