发明名称 CONNECTING PROCESS BETWEEN A PRINTED CIRCUIT AND A METALLIC SUBSTRATE
摘要 <p>The invention relates to earth connections between a printed circuit and a substrate supporting this circuit and forming a heat sink. It consists in forcibly inserting a needle (104) which pierces the printed circuit (101) and is then anchored in the substrate (103) while establishing the electrical connection between the two. It enables such a connection to be made without previously drilling a hole. <IMAGE></p>
申请公布号 EP0298855(B1) 申请公布日期 1992.01.02
申请号 EP19880401729 申请日期 1988.07.04
申请人 THOMSON GRAND PUBLIC 发明人 BERCOT, JACQUES
分类号 H01R4/64;H01R12/58;H05K3/38;H05K3/40;H05K3/44 主分类号 H01R4/64
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