发明名称 |
CONNECTING PROCESS BETWEEN A PRINTED CIRCUIT AND A METALLIC SUBSTRATE |
摘要 |
<p>The invention relates to earth connections between a printed circuit and a substrate supporting this circuit and forming a heat sink. It consists in forcibly inserting a needle (104) which pierces the printed circuit (101) and is then anchored in the substrate (103) while establishing the electrical connection between the two. It enables such a connection to be made without previously drilling a hole. <IMAGE></p> |
申请公布号 |
EP0298855(B1) |
申请公布日期 |
1992.01.02 |
申请号 |
EP19880401729 |
申请日期 |
1988.07.04 |
申请人 |
THOMSON GRAND PUBLIC |
发明人 |
BERCOT, JACQUES |
分类号 |
H01R4/64;H01R12/58;H05K3/38;H05K3/40;H05K3/44 |
主分类号 |
H01R4/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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