发明名称 |
LEAD FRAME PAD FOR SEMICONDUCTOR DEVICE |
摘要 |
The wing tip (8) is formed on one side or a pad to obtain the ground area so that the wire sagging and the wire sweep is prevented. A dimple is formed between the pad and the wing tip to prevent the epoxy resin from flowing into the wing tip in attach process so that the ground wire (5) can be bonded with the wing tip without wire sweep. |
申请公布号 |
KR920004364(B1) |
申请公布日期 |
1992.06.04 |
申请号 |
KR19890017138 |
申请日期 |
1989.11.24 |
申请人 |
HYUN DAI ELECTRONICS IND. CO., LTD. |
发明人 |
CHONG, JI - YONG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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