发明名称 |
Circuit board and process for manufacturing same |
摘要 |
A circuit board comprising a base having a substantially flat surface and an insulative layer made of a heat-resisting synthetic resin formed on the flat surface of the base. The insulative layer is provided with grooves for forming conductive parts, and each of the groove is defined by a bottom surface formed by the base and side walls formed by the insulative layer. A conductive adhesive layer having a good adhesion characteristic with respect to the base, such as Cr, is formed on the bottom surface of the grooves, and a conductive layer is formed on the conductive adhesive layer so that a surface defined by the insulative layer and the conductive parts including the conductive layer and conductive adhesive layer is substantially flat.
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申请公布号 |
US5153384(A) |
申请公布日期 |
1992.10.06 |
申请号 |
US19900572232 |
申请日期 |
1990.08.24 |
申请人 |
SHINKO ELECTRIC INDUSTRIES, CO., LTD. |
发明人 |
IIJIMA, TAKAHIRO;WAKABAYASHI, SHINICHI |
分类号 |
H01L21/48;H01L23/498;H05K1/03;H05K3/00;H05K3/10;H05K3/38;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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