Semiconductor chip with insulating frame - including heat sink and conductive structure

摘要

A novel semiconductor chip has (i) an insulating frame (10) with a top face recess (11) and a window opening (12) which extends vertically through the lower part of the frame into the recess; (ii) a metal or alloy heat sink (20) inserted in the window opening and attached to the frame; (iii) a conductive structure (13,14,15) which extends from the frame bottom face to a predetermined region on either the frame upper face or the bottom face of the recess; (iv) a semiconductor device (30) attached to the upper face of the heat sink; and (v) conductive wiring (40) bonded, at one end to the device (30) and, at the other end, to the conductive structure at the predetermined region. ADVANTAGE - Heat is rapidly conducted away so that the chip may have a high power semiconductor device. The device and its wiring are well protected and the chip is simple to mfr.