Integrated device

摘要

An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

主权项

1. An integrated device made up of a plurality of different types of devices separated from one another and mechanically joined together, wherein
each device comprises a functional element mounted onto a substrate, a groove having a side surface containing an inclined surface is formed between adjacent substrates, when a front surface is in a side of the integrated device where the functional element is mounted, the inclined surface makes the groove to become narrower along the direction from the front surface to a back surface of the integrated device, an insulating material is disposed at the groove, and adapted so that the plurality of substrates are mechanically joined together, while the devices are electrically insulated from one another.