| 摘要 |
A packaging system for electrical operational units is composed of several PC boards equipped with components of the so-called flat-pack type, which, on a component side, reside against coolant-permeated cooling plates and are supplied with operating and signal voltages from plugged and/or terminal connections. With the presently-known planar arrangement of such modules in a grid-type frame and with a joint coolant-permeated cooling plate, which lies on the side of the modules, considerable concentrations of components per volume unit could be achieved. The increasing requirements for computers with which an always increasing number of calculating operations is to be performed in the smallest space requires an always increasing concentration of components per volume unit, whereby the problem of heat removal and line supply becomes more acute. In order to achieve an even better concentration of components per volume unit, the present invention provides that, in an alternating sequence, respectively several flat-pack modules and cooling plates are arranged in a surface parallel fashion behind or above one another so that they form a block. The cooling plates are provided with coolant channels and with passageways perpendicularly thereto in which elasticaly-constructed pressure contacts for the wiring of the modules are arranged below one another. On those surfaces of the two outer modules that are not equipped with components, plug plates with recesses are provided for receiving line plugs for the signal supply, whereby on the other two sides of the block, operating voltages are provided and to the third side pair the coolant supply and the coolant discharge for the cooling plates are provided. Therefore, a three-dimensional wiring within the functional unit is enabled.
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