发明名称 |
High speed wafer handling method |
摘要 |
The present invention describes a loading system for high speed loading of wafers, such as semiconductor wafers, into vacuum chambers for various applications such as inspection or processing using, for example, a SEM. This system provides low contamination from atmospheric conditions both on loading and unloading the wafers.
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申请公布号 |
US5176493(A) |
申请公布日期 |
1993.01.05 |
申请号 |
US19910805232 |
申请日期 |
1991.12.11 |
申请人 |
NORTH AMERICAN PHILIPS CORPORATION |
发明人 |
TORO-LIRA, GUILLERMO L.;ABEL, ALAN C.;ACHILLES, ALAN H. |
分类号 |
B65G49/07;H01L21/677 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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