发明名称 High speed wafer handling method
摘要 The present invention describes a loading system for high speed loading of wafers, such as semiconductor wafers, into vacuum chambers for various applications such as inspection or processing using, for example, a SEM. This system provides low contamination from atmospheric conditions both on loading and unloading the wafers.
申请公布号 US5176493(A) 申请公布日期 1993.01.05
申请号 US19910805232 申请日期 1991.12.11
申请人 NORTH AMERICAN PHILIPS CORPORATION 发明人 TORO-LIRA, GUILLERMO L.;ABEL, ALAN C.;ACHILLES, ALAN H.
分类号 B65G49/07;H01L21/677 主分类号 B65G49/07
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