POSITIVE TYPE, PHOTOSENSITIVE RESINOUS COMPOSITION

摘要

of the disclosure A novel positive type photosensitive resinous composition comprising a base resin having in at least one side chain or at an end portion of its main chain, an iminosulfonate group of the formula: in which R1 and R2 are the same or different groups and each represents hydrogen atom, alkyl, acyl, phenyl, naphthyl, anthryl or benzyl group and R1 and R2, taken together with the carbon atom, may be an alicyclic ring, and a group containing an aciddecomposable bond, the content of said iminosulfonate group being 1X10-5 to 3X10-3 equivalent/g. The present composition, when irradiated with radiation with 200 to 400nm wavelength, can generate strong sulfonic acid groups, and is specifically useful as photoresist for circuit board, integrated circuit and the like.