| 摘要 |
PURPOSE:To make it possible to mount an IC chip in a small area by a method wherein bump electrodes are respectively provided at positions, which oppose to the connection pads of the IC chip, on an electrically insulative high-molecular film, the electrodes are made to project toward the side of the pads and the opposite sides to the sides made to protrude of the electrodes are made to connect to wiring circuit formed on the back of the film. CONSTITUTION:Bump electrodes 12 are respectively provided at positions, which oppose to connection pads 5 of an IC chip 4 to be mounted on an electrically insulative high- molecular film 11, on the electrically insulative high-molecular film 11 in such a way as to pierce the film 11. These electrodes 12 are made to project from the surface on the side, on which the chip 4 is mounted, of the film 11 and wiring circuit 13 are formed on the rear of the film 11 using the electrodes 12 as lead parts. Moreover, the pads 5 of the chip 4 are respectively pressure-welded on the electrodes 12 corresponding to these pads and the chip 4 is fixed on a substrate for IC chip mounting use with a bonding agent 16. Thereby, as the chip 4 is directly mounted on the substrate in a face down manner, the area and volume of a mounting part for the chip can be small and it is possible that the mounting part can cope with reduction in the areas of the pads 5 and the like. |
