| 摘要 |
PURPOSE:To enable a semiconductor device to be enhanced in heat dissipating effect by a method wherein molten sealing material is filled between an island and a heat dissipating thermal conductor without generating voids keeping a gap between the island and the heat dissipating thermal conductor constant against the injection pressure at molding. CONSTITUTION:A semiconductor chip 1 is connected to inner leads 3a with metal fine wires 4. An island 2 where the semiconductor chip 1 is mounted and heat dissipating thermal conductors 5 are arranged at a small interval confronting each other. A sealing material 6 is made to cover all the body excluding outer leads 3b and cured. A bent protrusion 9 and an opening 8 are formed by cutting the heat dissipating conductor 5 at a main body 5a and erecting a cut part, and the erected protrusion 9 is made to bear against the island 2, whereby the gap between the heat dissipating conductor 5 and the island 2 can be kept constant against the injection pressure at the molding of the sealing material 6. |
