| 摘要 |
PURPOSE:To provide a semiconductor chip module which is small in number of parts and excellent in heat dissipating properties. CONSTITUTION:A board 2 where a wiring section is formed, a semiconductor chip 6 mounted on the board making its circuit surface face the wiring section, a heat sink 3 whose edge comes into contact with the surface of the semiconductor chip 6 opposite to its circuit surface, and a cap 4 which is provided with a hole through which the other edge of the heat sink 3 is exposed outside and envelops the semiconductor chip 6 are provided. At least, a metal film is formed both on the inner wall of the hole concerned and on the surface of the heat sink 3 confronts the inner wall, and solder is filled between these metal films. |
