| 摘要 |
PURPOSE:To improve a mounting accuracy by pressing a bare chip on adhesive flatly smoothed in an adhesive smoothing process to mount it. CONSTITUTION:After an adhesive coating process 1 for coating with adhesive, an adhesive smoothing process 20 for extending the adhesive and flatly smoothing it, is provided. In a bare chip mounting process 2, the chip is pressed on the flatly smoothed adhesive, and mounted. Thus, when the chip is pressed and mounted, a deviating force is not substantially operated at the chip, and hence a deviation of the chip from a position to be mounted therewith is eliminated and the chip can be accurately mounted. |
