Solder interconnection verification

摘要

A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.