发明名称 STRUCTURE OF LEAD FRAME FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To prevent the generation of burrs of a synthetic resin in sections, from which each lead terminal 16 is projected, of the side faces of a molding body made of the synthetic resin when the molding body is molded to a lead frame for an electronic component. CONSTITUTION:Each lead terminal 16 is constituted so that thin width pieces 18 communicated with a lead frame 10 can be turned over in a turnover shape as being twisted while damming section 20 closely attached and made to abut against both side faces 16a, 16b of each lead terminal 16 turned over in the turnover shape are molded integrally to sections among each lead terminal 16 in the lead frame 10, and the side face 19a of a molding body 19 is specified by the damming sections 20.
申请公布号 JPH0563128(A) 申请公布日期 1993.03.12
申请号 JP19910222962 申请日期 1991.09.03
申请人 ROHM CO LTD 发明人 IMAI HIROSHI;MURAKAMI TADASHI
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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