HEAT SINK AND ATTACHING METHOD THEREOF

摘要

PURPOSE: To provide efficient heat sinks for cooling integrated circuit chips by surely and efficiently fitting plural heat sinks to plural integrated circuit chips which are loaded on one substrate. CONSTITUTION: Plural heat sinks 100 have been previously held and positioned by a carrying board 308, and adhesive blanks 306 are stuck to the heat sinks 100 by heat processing. An array of plural heat sinks carried by the board corresponds to the array of chips 332 loaded on a substrate 320, both the heat sinks 100 and substrate 320 are pressed, mutually pushed and heat-treated in that state for sticking plural heat sinks all together to plural chips. The heat sinks 100 are constituted as a three-dimensional blockwise shape forming many mutually connected holes and stuck to the chips by highly conductive adhesives.