| 摘要 |
PURPOSE:To accomplish sealing work without the movement of lead bases fused to the first glass of the base by a method wherein the periphery of the base is coated with the first sealing glass, and that of the cap wiht the second glass of lower softening point. CONSTITUTION:The lead base 6 is fused to the base 1 at 400-450 deg.C by using a low melting point glass 3 whose softening point is 400 deg.C. Next, a chip 5 is soldered at 400-450 deg.C and connected, and finally the cap 2 coated with a low melting point glass 4 of softening point at 350 deg.C is sealed at 400-450 deg.C. This construction enables sealing without the movement of lead bases at the time of sealing and without hindering the reliability. |
