| 摘要 |
PURPOSE:To provide a semiconductor device with high-density electronic circuitry. CONSTITUTION:A semiconductor device 1 includes a first semiconductor chip 11 having an electronic circuit 13 on its surface, and a second semiconductor chip 12 having an electronic circuit. The two semiconductor chips are joined on their back surfaces with an insulator 14 between them. One of the surfaces of the semiconductor device 1, having an electronic circuit 13 on each side, is provided with conductors connected with the circuit of the other side. These conductors are used to connect the circuits with external terminals. |
